GXCAS Electronic Components on ICGOODFIND SiteMap
最新文章
- Tier IV to Open‑Source Its Automotive AI Chip Design – Free NPU Blueprint by 2027
- Kioxia & Sandisk Launch 9th‑Gen 2Tb QLC 3D NAND – 4.8Gb/s Interface, 33% Faster
- Vishay Q2 2026 Revenue Hits $918.6M – Book-to-Bill 1.32 on AI Server Component Boom
- China Bypasses EUV Lithography – Vertical Graphene Transistor Hits 132GHz for 6G Chips
- Taiyo Yuden Q2 MLCC Profit Surges 53.5% – AI Servers Drive Capacity Crunch
- Google AI Legends Leave to Launch Discovery Loop – A New Era in Automated Science
- onsemi Q2 Beats Estimates – AI Server Power Revenue Doubles to $500M in 2026
- TFME Establishes $140M Shenzhen Subsidiary – Expanding Beyond Packaging into Full Semiconductor Chain
- AOS Rolls Out AmpStack Vertical-Stack 80V Half-Bridge MOSFET – Replaces Two DFN5x6 Chips
- Navitas Q2 Revenue Jumps 22% QoQ – AI Data Center Power Drives Strategic Pivot
- Lattice Semiconductor Chip Series Overview | CPLD / FPGA / Power Management IC Application Guide
- Taiyo Yuden to Raise MLCC Prices Again in September – Second Hike This Year
- CXMT Surges Past $50B Market Cap on STAR Market Debut – Overtakes Intel & Tencent
- Broadcom Popular Communication Chips Cheat Sheet for Hardware Engineers | PHY, Switch, Automotive, Gateway
- TSMC to Raise Foundry Prices Up to 25% in 2027 – HPC Orders Face Premium
- ASML High-NA EUV Components Arrive in Albany – U.S. R&D Gets Next-Gen Lithography Boost
- Kyocera CEO: Semiconductor Parts Boom to Last Until 2030 – Ceramic & MLCC Capacity Ramping
- AOS Alpha & Omega Semiconductor Full Product Line Overview: Popular MOSFET & Power IC Selection Guide
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- World’s First 8-Inch 2D Semiconductor Pilot Line Goes Live in Shanghai
- Samsung Tapes Out Tesla AI5 Chip on 2nm at Taylor Fab – Mass Production Set for 2027
- Silex Buys ON Semi’s 200mm U.S. Fab for $40M – MEMS Capacity Play
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- onsemi C106MG SCR: Datasheet, Pinout, and Application Circuit Guide
- onsemi NVBLS0D5N04CTXG: A High-Performance 40V, 5mΩ MOSFET for Advanced Power Management
- onsemi NVMFS4C05NT1G: 30V Single N-Channel PowerTrench MOSFET Datasheet and Application Review
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- Yongxi Electronics Bets $1.4B on Advanced IC Packaging Megaproject – Will 8-Year Payoff Justify the Gamble?
- SemiAnalysis: ChangXin Memory to Overtake Micron as #3 DRAM Supplier by Year‑End 2026
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
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- Nations Technologies Surges 20% on CPO MCU Roadmap for AI Optical Interconnects
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- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
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- Nvidia Pitches Vera CPU to China Clients: 88‑Core Arm Chip Launching August 2026
- SK Hynix to Triple Wafer Capacity by 2034, Picks Japan for First Overseas Fab
- Moore Threads Open‑Sources MusaCoder: LLM for GPU Kernel Generation, Trained Entirely on Domestic GPUs
- Samsung Plans New Advanced Packaging Plant in Gwangju to Boost HBM and AI Chip Capacity
- JCET Launches 3D Power Module Packaging Solution for AI Data Centers
- Nvidia’s New Vera CPU Picks SK Hynix DRAM as Memory Supplier
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- SK Group Halts SK Siltron Sale at Final Stage, Citing Supercycle and AI Strategy
- Geehy Launches Three G32A Auto MCUs – Mass Production for Body, Lighting, Thermal Management
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- STMicro and Arm Raise Forecasts on AI Infrastructure Boom – ST Sees $1B Data Center Revenue in 2026
- NXP LPC1112FHN33/102,5: A Comprehensive Technical Overview of the ARM Cortex-M0 Microcontroller
- NXP LPC1111FHN33/102,5: A Comprehensive Technical Overview of the ARM Cortex-M0 Microcontroller
- NXP LPC1113FBD48/303: A Comprehensive Technical Overview of the ARM Cortex-M0 Microcontroller
- NXP LPC11U24FBD64/401: A Comprehensive Technical Overview and Application Guide
- NXP LPC1112FDH28/102: A Comprehensive Technical Overview of the ARM Cortex-M0 Microcontroller
- The NXP LPC11E68JBD48E is a powerful 32-bit microcontroller built around the efficient ARM Cortex-M0+ core, operating at frequencies up to 50 MHz. Housed in a 48-pin LQFP package, this MCU is a stando
- LPC1114FBD48/302,1: A Comprehensive Technical Overview of NXP's ARM Cortex-M0 Microcontroller
- NXP LPC1112FHN24/202: A Comprehensive Technical Overview of the ARM Cortex-M0 Microcontroller
- Nuvoton NAU8421YG: 24‑Bit Stereo DAC with 128dB SNR, –99dB THD+N
- Marvell Q1 Revenue Hits Record $2.418B, Net Income Falls 81% on Acquisition Costs
- The NXP SPC5746RK1MMT5R: A High-Performance 32-Bit MCU for Automotive Safety and Powertrain Systems
- NXP TEA19361T/1J: A High-Performance Controller for Efficient Quasi-Resonant Flyback Power Supplies
- NXP SC667543VLU: A High-Performance Multicore DSP for Advanced Signal Processing Applications
- NXP SC16C654BIB64,151: A Comprehensive Technical Overview of the Quad UART with 64-Byte FIFOs
- NXP SN100TUK1: A Comprehensive Technical Overview of the Advanced NFC and Secure Element Solution
- NXP SA612AD/01,118: A Comprehensive Technical Overview of the Low-Power Mixer/Oscillator IC
- NXP PTVS60VS1UR: A High-Performance TVS Diode for Robust Circuit Protection
- NXP SC16IS752IBS,151: A Dual UART with I²C/SPI Interface Bridge IC for Industrial Applications
- Huawei Kirin Chip Breaks 3GHz with Logic Folding, Unveils Tao Law at ISCAS 2026
- Alibaba Cloud Unveils Zhenwu M890 AI Chip and 128‑Card Supernode Server
- AMD’s Su Meets China VP He Lifeng, Pledges More Investment and Compute Partnership
- ChangXin Memory Q1 Profit Hits 4.6 B , R e v e n u e S u r g e s 719 4.6B,RevenueSurges7197.1B
- NXP BCM856DS: A High-Performance Clock Generator for Advanced Networking and Telecommunications Systems
- Unlocking the Potential of the NXP MKW38A512VFT4R: A Comprehensive Look at its Bluetooth 3 Low Energy/Thread Connectivity and Advanced Security Features
- NXP PN5482D2EV: A Comprehensive Overview of the Advanced NFC Controller
- HuaHong Q1 Profit Soars 458% to $20.9M, 12-Inch Revenue Hits 62.7%
- NXP PTVS30VP1UTP: A High-Performance TVS Diode for Robust Circuit Protection
- NXP MAX809RD Microprocessor Supervisory Reset Circuit: Features, Applications, and Design Considerations
- NXP BC817-215: A Comprehensive Technical Overview of the General-Purpose NPN Transistor
- NXP PCAL9555APW: A Comprehensive Technical Overview of the Low-Voltage 16-Bit I2C-Bus I/O Expander
- NXP BGA2818,115: A Comprehensive Technical Overview of the 4 GHz Silicon Low-Noase Amplifier MMIC
- AMD Quietly Takes Stake in Marvell as Nvidia Commits $2B to Strategic Partnership
- US Pressures Tesla to Move AI6.5 Chip Orders from TSMC to Intel
- NXP BZV55-C2V4: A Comprehensive Technical Overview of the 4V Zener Diode
- NXP 74AVC16T245DGG: A 16-Bit Dual-Supply Bidirectional Voltage Level Translator with 3-State Outputs
- NXP TJA1027TK/20: A Comprehensive Technical Overview of LIN System Basis Chips
- NXP BCV46: A Comprehensive Technical Overview of the General Purpose NPN Transistor
- NXP LPC1850FET256: A Comprehensive Technical Overview of the High-Performance ARM Cortex-M3 Microcontroller
- NXP MC33771BTA1AER2: A Comprehensive Technical Overview of its Features and Applications in Battery Management Systems
- NXP LPC812M101JDH20FP: A Comprehensive Overview of the Arm Cortex-M0+ Based Microcontroller
- NXP 74LVC4066PW: A Comprehensive Guide to the Quad Bilateral Analog Switch IC
- TSMC Arizona’s Third Fab Tops Out, Set for 2nm Production
- Arrow Electronics Q1 Revenue Jumps 39% to $9.47B, Beats Wall Street Estimates
- Astera Labs Unveils 320‑Lane PCIe Switch – Industry’s Largest
- Lattice Buys Firmware Giant AMI for $1.65B – Aiming at AI Data Centers
- NXP PCAL6408AHKX: A Comprehensive Technical Overview of the Low-Voltage 8-Bit I²C-Bus I/O Expander